Design of Mechatronic and Embedded Systems

Module Information

Module Semester:
Module Part:
Sub-Module Code:
Hours per Week:
Module ECTS Credits:
Available to ERASMUS Students:

Module Objective

The aim of the course is to provide students the basic principles of operation of mechatronic and embedded systems. 

Module Study Targets

The course introduces postgraduate students to the applications of embedded systems in mechatronics that are used widely nowadays. Upon completion of the course, students will have:

  1. Recognize and critical understanding of the theory and principles of embedded systems.
  2. Analysis and development of applications with embedded systems.
  3. Recignize and understand basic mechatronic systems.
  4. Development and programming of embedded systems.
  5. Development and analysis of applications with mechatronic systems.

Module Acquired Abilities

  • Analysis, development and implementation of the theoretical aspects of mechatronic and embedded systems.
  • Evaluation of proposals related to mechatronic systems. Evaluation of proposals regarding the handling of problems related to embedded systems and adaptation of new technologies.
  • Synthesis of techniques for composite problems.
  • Knowledge of development tools, new methods and scientific achievements.
  • Ability to follow the international bibliography and the scientific events.

Module Description

  •  Introduction to the basic principles of mechatronic systems.
  • Sensors, technical specifications.
  • Actuators
  • Computer interfacing
  • Models
  • Bond graphs
  • Simulation of mechatronic systems
  • Control architectures
  • Design analysis and synthesis of mechatronic systems
  • Robotics

Module Student Evaluation

Written examination = 50%

Exercises = 50%


  • Robert H. Bishop, "THE MECHATRONICS HANDBOOK", University of Texas at Austin, Texas
  • M. Nakamura, S. Goto, N. Kyura, "Mechatronic Servo System Control Problems in Industries and their Theoretical Solutions"
  • Georg Pelz, "Mechatronic Systems Modelling and Simulation with HDLs", Infineon Technologies, Munich, Germany